Core Technical Capabilities
A Decade of Hardware Evolution: 2016 – 2026
My professional journey began in 2016 with a single hobby project and has evolved into a decade-long pursuit of mastering the physics of hardware. I hold a Master’s degree from National Tsing Hua University (2022), where I focused on the critical intersection of advanced research and manufacturable systems. I operate at the high-end of intermediate design, moving toward expert-level implementation with a rigorous, physics-first approach.
I specialize in high-speed digital architecture (8+ layers) involving LPDDR4 SDRAM and PCIe interfaces, with a strict focus on Signal and Power Integrity (SI/PI). Grounded in Analog CMOS IC Design and Mixed-Signal Integration, I utilize advanced simulation-driven workflows in Altium Designer to ensure every board is optimized for high-yield manufacturing and reliability.
Technical Specializations & Scope
Leveraging a decade of hardware evolution (2016–2026) to bridge the gap between advanced research and physical, manufacturable hardware.
Advanced High-Speed PCB Layout
Complex Multi-layer Design: Specializing in 8+ layer stackup architectures and precision routing for high-density interfaces like LPDDR4 SDRAM, DDR4, and PCIe.
High-Speed Signal Classing: Utilizing Altium Designer xSignals and hierarchical structures to manage massive pin-package delays and timing-critical nets.
- Manufacturing Standards: Adhering to IPC Standards for Design for Manufacturing (DFM) and Assembly (DFA) to ensure high-yield production from the first prototype.
Hardware System Architecture
Full-Cycle Development: Leading projects from complex mixed-signal schematics to validated hardware, including RK3399 System-on-Module (SOM) and Ethernet PHY integration.
Precision Analog Front-Ends: Designing high-performance interface circuits with precise bandwidths and high-gain architectures (200 V/V) based on Analog CMOS IC Design principles.
Power Converter Design: Architecture and implementation of high-efficiency Buck/Boost converters and H-Bridge systems using custom magnetic component design.
SI/PI Analysis & Simulation
Signal Integrity (SI): Performing rigorous analysis on return paths, differential impedance matching, and crosstalk mitigation to ensure zero-defect signal transmission.
Power Integrity (PI): Validating Power Delivery Networks (PDN) and optimizing decoupling strategies to maintain stable energy delivery for high-bandwidth silicon.
EMI/EMC Optimization: Applying advanced layout techniques to minimize electromagnetic interference and ensure system-level qualification for global certifications.
Design & Simulation Suite
Mastering the physics of high-density systems.
By integrating advanced EM simulation environments into every stage of the design cycle, we ensure that high-speed architectures remain stable, reliable, and optimized for real-world performance
Altium Designer
MATLAB / Python
Capabilities & Hardware Track Record
A decade of translating complex mixed-signal architectures into bench-tested, physical hardware
